Electronic film

In the 3C electronics industry, material selection is driven by the need for lightweight design, advanced lamination compatibility, and stable high-temperature performance. NicheTech Advanced Materials introduces the TP212 Thermoplastic Film and TS610 Thermoset Adhesive Film, offering high adhesion strength, low-temperature lamination, low VOC emissions, and exceptional heat and chemical resistance. These solutions are engineered to support the assembly of smartphones, wearables, laptops, and precision modules.
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TP212 Thermoplastic Film

 

Recommended Processing Conditions
Final Lamination Temperature 110~130°C
Time 30 ~ 40 seconds 
Pressure  3~6bar

* Pre-lamination surface preparation is recommended to ensure optimal bonding
(surface must be clean, dry, and free from dust, oil, grease, and mold-release agents).
=>PU, PET, PC, ABS, Glass: Wipe with IPA or apply plasma treatment
=>Nylon, Polyolefin, Fiberglass, and other engineering plastics: Corona, plasma, or electric discharge treatment
* For specific applications, please contact our technical team for optimized parameters.

 

TS610 Thermoset Adhesive Film

Recommended Processing Conditions

Stage 1: Pre-Bonding Conditions
Pre-Lamination Temperature 60 ~ 70°C
Time 10 ~ 20 seconds
Pressure  2~4bar
Stage 2: Final Bonding Condition
Final Lamination Temperature 100 ~ 130°C
Time 20 ~ 30 seconds
Pressure  3~6bar
100713091_m (1) * Pre-lamination surface preparation is recommended to ensure optimal bonding
(surface must be clean, dry, and free from dust, oil, grease, and mold-release agents).
=>PU, PET, PC, ABS, Glass: Wipe with IPA or apply plasma treatment
=>Nylon, Polyolefin, Fiberglass, and other engineering plastics: Corona, plasma, or electric discharge treatment
* For specific applications, please contact our technical team for optimized parameters.