Semiconductor Film

In semiconductor manufacturing processes,various temporary
adhesive tapes are used.Among them, thermoplastic polyolefin
film (TPO film) is one of the key base materials for adhesive
tapes.
 

DCF-E series TPO film, developed by NicheTech Advanced,
features excellent thickness uniformity and is suitable for
use as a dicing tape base material in applications such as
semiconductor wafers, chips, glass substrates, and LED
industries.

组 1669

Basic Properties of DCF-E Series




* For other thicknesses or customized specifications,
please contact our technical staff.

 

 

  DCF-E80 DCF-E90 DCF-E100
Thickness 80 um 90 um 100 um
Thickness uniformity < ± 3um
25% Stress

MD:> 6 MPa
TD:> 6 MPa

100% Stress

MD:> 9 MPa
TD:> 9 MPa

Elongation

MD:> 600%
TD:> 600%