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Semiconductor Film

In semiconductor manufacturing processes,various temporary
adhesive tapes are used.Among them, thermoplastic polyolefin
film (TPO film) is one of the key base materials for adhesive
tapes. 

DCF-E series TPO film, developed by NicheTech Advanced,
features excellent thickness uniformity and is suitable for
use as a dicing tape base material in applications such as
semiconductor wafers, chips, glass substrates, and LED
industries.

组 1669

Basic Properties of DCF-E Series




* For other thicknesses or customized specifications,
please contact our technical staff.

 

 

  DCF-E80 DCF-E90 DCF-E100
Thickness 80 μm 90 μm 100 μm
Thickness uniformity < ± 3μm
25% Stress

MD：> 6 MPa
TD：> 6 MPa
100% Stress

MD：> 9 MPa
TD：> 9 MPa
Elongation

MD：> 600%
TD：> 600%

Dicing tape Series




*For further technical details,
  please contact our team for assistance. 

 

  NTC-ST080 NTC-EL080 NTC-SP110-UV NTC-SP090
Specifications 80 +/-2 μm 80 +/-2 μm 100μm ESD PO+10μm UV-PSA  90um ESD-PO

BG tape Series




*For further technical details,
  please contact our team for
  assistance. 

 

  NTG-X120T NTG-X400T NTG-X575T
Specifications 5070
(50μm PET+70μm elastomer)		 50350
(50μm PET+350μm elastomer)		 75500
(75μm PET+500μm elastomer)

Pressure Conductive Silicone Rubber, PCR





Customized with Customer-Specified Metallic Powders.
Engineered to deliver high temperature resistance,
excellent elongation,and controllable electrical resistance 
performance for advanced conductive film.

*For further technical details,please contact our team for 
assistance.

 

Property Target Range
Heat Resistance <220℃
Hardness 40 - 70 Shore A
Tensile Strength > 1.6 MPaShore A
Elongation at Break 40% - 250%
Pressure-Induced Electrical
Resistance Variation
 Initial Resistance: ~1 kΩ
Under Compression: < 30 mΩ
Film Thickness 150 – 400 μm

Dry Metal Lift-off film



Dry Metal Lift-off is a technique that removes unwanted metal thin films through
a mechanical process (such as tape peeling), eliminating the need for chemical
solvents. By avoiding the use of chemical solvents, it minimizes potential damage
to substrates and devices while reducing environmental impact.
By using Nichetech's co-extrusion technology, a dual-layer metal lift-off film is
fabricated by simultaneously co-extruding a highly uniform polyolefin-based
carrier film and an EVA hot-melt adhesive layer.

  • Excellent Film Thickness Uniformity
  • Solvent-Free Manufacturing Process
  • Eco-Friendly Process

*For further technical details,please contact our team for 
assistance.

 

Item Thickness(µm) TTV(µm) Stress at 30% Strain(MPa) Stress at 50% Strain(MPa) Stress at 100% Strain(MPa)
DL115 115  ±5   >6 >7 >9