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Semiconductor Film

In semiconductor manufacturing processes,various temporary
adhesive tapes are used.Among them, thermoplastic polyolefin
film (TPO film) is one of the key base materials for adhesive
tapes. 

DCF-E series TPO film, developed by NicheTech Advanced,
features excellent thickness uniformity and is suitable for
use as a dicing tape base material in applications such as
semiconductor wafers, chips, glass substrates, and LED
industries.

组 1669

Basic Properties of DCF-E Series




* For other thicknesses or customized specifications,
please contact our technical staff.

 

 

  DCF-E80 DCF-E90 DCF-E100
Thickness 80 um 90 um 100 um
Thickness uniformity < ± 3um
25% Stress

MD：> 6 MPa
TD：> 6 MPa
100% Stress

MD：> 9 MPa
TD：> 9 MPa
Elongation

MD：> 600%
TD：> 600%

Dicing tape Series




*For further technical details,
  please contact our team for assistance. 

 

  NTC-ST080 NTC-EL080 NTC-SP110-UV NTC-SP090
Specifications 80 +/-2 um 80 +/-2 um 100um ESD PO+10um UV-PSA  90um ESD-PO

BG tape Series




*For further technical details,
  please contact our team for
  assistance. 

 

  NTG-X120T NTG-X400T NTG-X575T
Specifications 5070
(50um PET+70um elastomer)		 50350
(50um PET+350um elastomer)		 75500
(75um PET+500um elastomer)

Others




*For further technical details,
  please contact our team for
  assistance. 

 

Series Material Specifications
Metal lift off film NTL-DL115 115um
(50um PE+65um EVA)
Dust-Collecting Film NTN-C1000 90um PP+10um PSA
Chemical-Resistant Film NTA-CR1500 1.5mm Foamed Sheet