Semiconductor film
Precision protection for every wafer
Wafer Surface Protection — Safeguards the circuit layer from scratches and mechanical stress during back grinding
Why it works
Our tape is specially designed to protect delicate wafers through every stage of handling and processing
Contamination prevention
Contamination prevention
Blocks water, grinding fluids, and debris from contaminating wafer surfaces
Maintaining wafer integrity
Stabilizes thinned wafers, reducing breakage risk during handling and dicing
Easy removal
UV-release adhesive ensures residue-free removal after grinding
Cushioning layer
Fully encapsulates the wafer for complete protection
Reliable handling
Maintains integrity through shipping, testing, and assembly
Product options
NTG-X120T
Standard protection for general processes (120mm)
NTG-X400T
Enhanced cushioning for higher handling stress (400mm)
NTG-X575T
Maximum protection for critical applications (575mm)
NTC Series
Dicing tape
NTG Series
Back grinding tape
NTL Series
Dual-layer film
NTN Series
Cleaning film
NTA Series
Chemical resistant film
